The X2.5 is a high-speed x-ray system with programmable angle shot capability. Is said to be suitable for automatic solder joint inspection of double-sided PCBs with high throughput. Includes variable angle control from 0° to 45°; enables automatic inspection of bump solder joints (BGA hardball) or filling level checking of PTH/THT solder joints for connectors. Uses slice-filter technology for hidden or overlapped joints. Uses wide beam x-ray source with a radiation cone of up to 100°. Is said to have a minimal x-ray focal spot of 5 µm. Uses CMOS flat panel technology with a pixel resolution of up to 25 µm; object resolutions of 5 to 10 µm. The linear drive table can position the object with an accuracy of up to < +/- 5 µm and max accelerations of up to 1G; achieves test speeds up to 4 x-ray images/sec., including input and processing.

MatriX Technologies, www.m-xt.com