Multicore LF730 Pb-free solder paste uses DAP Plus Type 4 solder powder and a flux medium said to permit greater process latitude. Reportedly prints thorough apertures as small as 160 µm, permitting more solder per aperture with less risk of aperture clogging. Volume release is said to be over 90%. 

Wets to a range of surface finishes, and can be used in environments from 30°C at 84% RH. Features open and abandon times of two to three hours, standard refrigeration storage, six-month shelf life and good hot slump resistance.

Henkel, www.henkel.com/electronics

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