SEHO Systems Rolls Out Dual Lane Reflow Oven
Published: 08 December 2009
Dual Lane Reflow Oven provides high- and low-volume SMT soldering in one reflow unit. Features flexible production in parallel and is compatible for both Pb-free and leaded SMT. Reportedly reduces floor space 47% compared to traditional dual-lane production lines. Contains two independent conveyor lanes and two heating areas. Has 18 independently programmable heating zones, with both top and bottom side heating areas. Conveyor speeds and widths are independently controlled and adjustable.
SEHO Systems GmbH, www.sehona.com
Press Releases
- ITW EAE Expands Partnership with Etek Europe to Represent Despatch Products in the UK and Ireland.
- PARMI USA, INC. Appoints Juan Arango as Head of Sales and Business Development to Drive U.S. Market Growth
- Naprotek Welcomes Aerospace and Defense Veteran to Board of Directors
- Variosystems Highlights Focus on Full-System Solutions with New Brand Identity