Siplace CA combines die placement from wafers with classic SMT placement technology. Reportedly eliminates special die bonding processes. Processes flip-chips from wafers at high speeds together with passive components from reels. Is based on Siplace X series, with additional wafer systems as feeders. Features include flip unit, special vision systems, and linear flux dip unit. Each Speedstar CP 20 head is able to place up to 9,000 flip-chips or 6,000 die-attach components per hr. in sizes ranging from 0.8 to 18.7 mm with an accuracy of ±10 µm. Can handle different wafers, which are replaced automatically. Punch-out speed is programmable. Requires only one pass through the oven.

Siemens, www.siplace.com

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