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New Products
Shinkawa Debuts LFB-1000 Flip-Chip Bonder
Shinkawa Debuts LFB-1000 Flip-Chip Bonder
Published: 03 May 2010
LFB-1000 flip-chip bonder handles large-scale ICs.
Capabilities include NCP, chip-on-chip and copper pillar processing.
Shinkawa,
www.shinkawa.com
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