Hysol Eccobond CA3556HF silver-filled electrically conductive adhesive is said to offer fast cure at low temperature. Suitable for crystalline-silicon and thin film manufacturing. Delivers a bond between Ag- and SnPbAg-coated tabs and c-Si cells. Stress minimization properties compensate for CTE mismatches. No-mix, one-part formula. Applications include membrane switches, displays on temperature-sensitive substrates, automotive sensor and RFID tag assembly.

Henkel Corp., www.henkel.com/electronics

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