Hysol Eccobond CA3556HF silver-filled electrically conductive adhesive is said to offer fast cure at low temperature. Suitable for crystalline-silicon and thin film manufacturing. Delivers a bond between Ag- and SnPbAg-coated tabs and c-Si cells. Stress minimization properties compensate for CTE mismatches. No-mix, one-part formula. Applications include membrane switches, displays on temperature-sensitive substrates, automotive sensor and RFID tag assembly.
Henkel Corp.,
www.henkel.com/electronics
