Innova and Innova + direct die feeders enable presentation of wafer-level devices to GenesisSC platform. Are portable; can assemble a complete module on a single machine, placing die and passives precisely. Can install multiple feeders on a single placement machine with minimum feeder slot consumption. Alternate feeder functionality permits continuous running of like part numbers on multiple feeders. Present a wide variety of flip chips or circuit-up devices with easy relocation. Process wafers of various sizes up to 300mm. The latter processes up to 13 300mm wafers with on-board expansion capabilities.

Universal Instruments Corp., www.uic.com

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