CondensoX vapor phase soldering (condensation) reflow soldering oven features a hermetically-locked vacuum chamber. Combines vacuum profiling and thermal profiling in one machine. By enabling the operator to solder variable-sized components with small delta Ts even in the pre-heating zone, Accommodates heights up to 100mm. Lowers boiling point of media to accommodate lead and lead-free profiles. Applied vacuum directly at the point where required temperature is reached. Manual, automatic, and high-speed loading configurations available. Features two carriers that work synchronously to cut cycle time up to 50%.

Rehm, www.rehm-group.com

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