OptiCon X-Line 3D x-ray inspection system enables a safe quality control of solder joints on opposed mounted BGA components, such as in double-sided equipped DDR-RAM modules. Single-sided and double-sided equipped PCBs can be inspected within one test run. Can analyze both top and bottom sides of boards and all layers in between layer by layer. Each BGA solder ball is localized in x/y-direction, as well as z-direction. Relevant parameters of each solder joint are determined in three layers. Open solder joints and wetting defects can be detected; voids can be determined in size and z-position within a solder joint. Is able to detect solder connections at IC pins and two-pin components, as well as THT components. Uses GigaPixel image technology. Real-time multi-angle image recording enables a test speed of 40cm²/s for full 3D PCB capturing. Integrated reconstruction methods, based on digital tomosynthesis, allows defined evaluation of single layers.

Goepel electronic, www.goepel.com 

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