X-Plane x-ray inspection system views individual 2D slices within a sample from top-to-bottom, front-to-back, left-to-right, and any plane in between. Can use anywhere in an 18" x 16" inspection area. No need to cut or destroy the board. Works at high magnifications. Available on Diamond FP, Diamond, Ruby FP, and Ruby x-ray systems. Shows position and size of voids at joint interfaces and other locations within BGA, CSP, QFN, LGA, etc.; identifies Head in Pillow and open joints; inspects different layers within package on package or MCM; identifies tilted components and board warpage.

Nordson Dage, www.nordsondage.com

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