AR4HT series CSP sockets accept any area-array device for high-temperature testing up to +200°C. Incorporate a low-profile 0.45mm contact structure (compressed) that is shorter than other low-profile contacts. Provide compliance for reliable ATE testing and burn-in. Accommodate BGA, LGA, QFN, DFN, CSP, MLCC and PoP, as well as bumped die with full and partial arrays. Full socket operating temperature is -55° to +200°C, with a life expectancy of more than 10,000 actuations. Socket can accommodate IC devices with a pitch of 0.4mm or greater, as well as mixed pitch environments. Interposer set is comprised of silver particles within a silicon elastomer with a polyimide core. Initial contact force is 20 to 30gm per lead. Available in custom sizes.

Aries Electronics, www.arieselec.com

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