Goepel Introduces OptiCon SPI-Line 3D SPI
Published: 14 May 2012
OptiCon SPI-Line 3D solder paste inspection system is offered in three different configurations determined by pixel resolutions of 10µm, 15µm and 20µm. Has inspection speed up to 90cm². Is fully compliant to all OptiCon AOI systems. Has a 3D camera head functionally based on fringe projection principle, operating without moving parts. Includes newly developed user interface SPI-Pilot. Offline programming station and module for statistic process control evaluation are offered as add-on options.
Goepel electronic, www.goepel.com
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