OptiCon XI-Pilot 3.0 x-ray inspection system software enables higher image recording speed at increased sensibility. Compensates for PCB warpage or automatic stability control of image sequence. Detects and compensates PCB slag during inspection, for true to height solder layer reconstruction. Determines whether entire assembly or each partial circuit of a value should be compensated. Uses laser triangulation sensor determine PCB warpage. Compensates for PCB slag directly in the recorded images using software algorithm. Automatically detects changes in x-ray image chain and recalibrates images chain at lower deviations of acceptable tolerances. Reportedly ensures image geometry characteristics as well as intensity (grey values) are situated in an adjustable tolerance range.

Goepel Electronic, www.goepel.com

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