ASM Rolls Out iHawk Xpress Opto Wire Bonder
Published: 16 May 2012
iHawk Xpress has an improved transport to handle lead frames up to 100mm wide. Bonding accuracy improved to 3µm, and novel GoCU technology enables faster operation with copper wire. Ensures bonding wire is clamped in place and automatically rethreaded after a break, minimizing downtime and improving productivity.
ASMPT, www.asmpacific.com
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