LTS 300 is an automated hot dip solder lead tinning system for reconditioning plated through-hole, SMT and QFP components. Reportedly ensures compliance with RoHs and reliability requirements. Combines three tinning processes in one machine; performs a dip process for through-hole components, a drag process for chips and LCCs, and is equipped with a vacuum-articulated spindle for tinning QFP leads. Applications include refurbishing legacy components; gold embrittlement mitigation; tin whisker mitigation; converting RoHS components to Sn/Pb and vice versa; solderability testing, and BGA cleansing. Employs a dip process for T/H components, using a flat wave solder nozzle, working in conjunction with pallets that hold the components in position. A pallet of components moves to the flux station, followed by preheating, then to the first solder pot to remove coating. A side-to-side motion provides a scrubbing action to help dissolve plating into the scavenging alloy. Pallet returns to flux station, where leads are fluxed and conveyed to second solder pot for intermetallic coating.

ACE Production Technologies Inc., www.ace-protech.com
 

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