X3L 3D inline x-ray inspection system comes with dual detector, combining a line-scan for transmission inspection of PCBs in a few sec. and a high-res digital flatpanel detector for selective 3D image capturing. Offers transmission, off-axis image capturing, and 3D-SART. Uses a readout TDI camera (line scanner) in parallel, reducing image capturing for 18x16" PCBs to fewer than 10 sec. 3D-SART (simultaneous algebraic reconstruction technique) provides slice images for solder joint analysis. Uses MIPS platform with links to MIPS software modules for programming, classifying and verification. MIPS verify now supports defect image verification with an extended 3D functionality.

MatriX Technologies, www.m-xt.com

• Prev
• Next