BiAgX high-melting Pb-free solder paste is designed as a drop-in replacement for lead-containing solder pastes. Has passed MSL1 and thermal cycle testing. Works in environments in excess of 150°C; requires minimal process adjustments. Is Sb-free and does not contain specialty materials such as nanosilver or sintering aids. Comes in dispensing and printing forms. Fluxes are cleanable with standard cleaning chemistries and processes.

Indium, www.indium.com/BiAgX

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