FX-940 inline AOI features 9-MP color camera imaging. Includes top-down viewing camera, four side-viewing cameras and 3D inspection. Inspects solder joints and component assembly for solder defects, lead defects/lifted leads, component presence and position, correct part/polarity, through-hole parts, and coplanarity of chips, BGAs and other height-sensitive devices. Configurable for all line positions. Can be used for paste, pre / post-reflow and final assembly inspection. Intuitive offline programming. Real-time SPC monitoring. Uses a standard package library to simplify training and ensure program portability across manufacturing lines.

Nordson YesTech, www.nordsonyestech.com

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