Viscom Rolls Out FastFlow Transport
Published: 05 June 2014
FastFlow high-speed transport reportedly optimizes throughput and shortens cycle time.
Is available for the S3088 family of inspection systems. Facilitates changeovers in as little as 2 sec. XM 3D sensor module provides cycle times at high inspection depths.
Viscom, www.viscom.com
Press Releases
- RBB Partners with LogiSync to Enhance In-house Design Capabilities
- Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024
- OKI Develops Ultracompact Photonic Integrated Circuit Chip Using Silicon Photonics Technology to Realize Various Optical Sensors
- AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum