Auto-Dip systems feature touch-screen controlled models with programmable preheat and dip height settings and an adjustable, finger-type printed circuit board holder that grips the edges of the board throughout the soldering cycle. Is useful for heavy component-laden assemblies; can accept customized pallets of small, irregularly-shaped PCBs. An interchangeable version of the pin-type PCB holder is included; permits simultaneous soldering of multiple PCBs, randomly placed on the fixture-less bed-of-nails loading platform. Have titanium solder pots with high-precision temperature controllers for use with Pb-free SAC or SnPb solders. Include automatic dross skimmer and collection trough and startup timer. Largest model can handle PCBs up to 600 x 350mm; has a 100kg solder pot. EZ-Flux 500A spray fluxing system included. For short-run batch applications.

Manncorp, http://www.manncorp.com/Auto-Dip.html

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