Tamura Releases VER II Reflow Oven
Published: 14 May 2014
TNV25-508EMII-P convection reflow oven features a new flux collection system, an 8 degree per sec. cooling capability, and reduced nitrogen consumption (equal to or less than 500ppm: 100NL/min; equal or less to 200ppm: 180NL/min). Is 4996 x 1368 x 1690mm. Handles boards up to 250mm (width) x 330mm (length).
Tamura Systems, www.tfz-tamura.com
Press Releases
- RBB Partners with LogiSync to Enhance In-house Design Capabilities
- Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024
- OKI Develops Ultracompact Photonic Integrated Circuit Chip Using Silicon Photonics Technology to Realize Various Optical Sensors
- AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum