SMT256/SMT266 chip assembly and ball attachment encapsulants can be dipped, printed, jetted or brushed at temperatures ranging from 140°  to 260°C. Are said to enhance solder joint reliability and eliminate solder joint cracking in microchip applications, reportedly creating a solder joint bond five to 10X stronger than a conventional solder joint. For use in Pb-free, SnPb and SnBi processes. Reworkable.

Yincae Advanced Materials, www.yincae.com

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