Amtech VS-213 no-clean, lead-free solder paste formula is halogen-free based on all testing methods, including oxygen bomb combustion and ion chromatography. Is said to be environmentally friendly and fully compliant with ROHS 2011/65/EU. Helps prevent voiding when soldering LGA, BGA, CSP and QFN packages. Wets easily, has long stencil-life, and 16-hour abandonment time. Thermally stable at temperatures up to 300oC. Meets highest IPC 7095 voiding performance classification of Class 111. ROL0 flux classification. Post-reflow residue said to be nonconductive and noncorrosive.

SMT International, www.amtechsolder.com

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