caLogo

SMT 88 series underfills enable a faster cure while at room temperature. Are adhesives that reportedly combine advantages of fast cure in UV adhesives and reliability of capillary underfill. Can be underfilled at room temperature without preheating a substrate. Advantages include void-free underfill, easy rework, easy dispensing, outstanding reliability, and excellent mechanical resistance. Can be used for chip scale packaging, ball grid array devices, package-on-package, land grid array, and flip chip applications. Suitable for bare chip protection in packages such as memory cards, chip carriers, hybrid circuits and multichip modules.

Yincae Advanced Materials, www.yincae.com  

 

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article
Don't have an account yet? Register Now!

Sign in to your account