Has thermal conductivity of more than 10 BTU in/ft²•hr•°F with excellent electrical insulation properties. Is for potting, bonding, sealing and coating applications. Can be used in larger potting applications; has low exotherm when curing. Low coefficient of thermal expansion (CTE), enhanced dimensional stability, a high modulus and superior compressive strength properties.

Master Bond, www.masterbond.com
 

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