RW1200 SMT/BGA rework system includes high-def vision, IR underheating, and component alignment. Handles boards up to 16.1" x 14.6." Comes standard with a 1.3Mp split-vision CCD camera and 15" 1080p HD display. Joystick-controlled zoom with 230X magnification and high-brightness LED lighting provide superimposed views of component leads and printed circuit board solder pads for alignment using X, Y, and Θ axis µm. In conjunction with its Z-axis drive mechanism and automatic height sensing, it provides ±0.01mm placement accuracy for 0.3mm lead pitch µBGAs and QFPs. Heater nozzles for components from 2 x 2mm to 55 x 55mm direct up to 1200W of hot air from the upper heater to component. Adjustable hot air flow control. 1200W bottom heater is surrounded by a 2700W, rapid IR underheater.  

Manncorp, www.manncorp.com

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