Stannostar HMM-1000 MSA-based, pure tin plating process is for deposition of reflowable, pure tin in medium- and high-speed equipment. Non-fluoborate process is formulated to produce matte to semi-bright pure tin deposits without oiling out of the organic compounds. Deposits are said to have consistent, stable surface morphology and are suitable as a “low whisker,” lead-free alternative finish. Pure tin deposits contain minimum organic inclusions that exhibit excellent covering power and a high degree of ductility. The deposits exhibit superb solderability and low carbon content over wide temperature and current density ranges, as well as high efficiency, low foam and uniform dissolution of anodes. For plating parts with complex geometries, including electronic housing and connectors. 

Enthone, an Alent Co., www.enthone.com

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