M8 no-clean solder paste, developed in combination with T4 and finer lead-free alloy powders, provides stable transfer efficiencies. Novel activator system provides durable wetting action, accommodating a range of profiling processes and techniques. Is said to eliminate HiP defects on BGAs and reduce voiding on QFN/BTC components while producing bright shiny solder joints, leaving minimal, high purity residue engineered to be left in place. Based onl NC258 platform.

AIM Solder, www.aimsolder.com

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