Integra V1 boundary scan demo module detects integration specific faults. Demonstrates integration solutions with test methods such as functional test, in-circuit test, manufacturing defects analyzer and flying probe test. Contains various boundary scan structures, as well as non-boundary scan components. Production faults can be simulated by switch; signal states can be monitored. Additional test points allow testing of non-scannable partitions. Includes production-capable contacting options, such as test points, ribbon cable, GTAP, etc.

Goepel electronic, www.goepel.com

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