Gap Pad EMI 1.0 low stress thermal interface material unites thermal conductivity with EMI absorption capabilities. Offers heat and electromagnetic energy control. Has thermal conductivity of 1W/m-K and EMI absorption for frequencies above 1GHz. Thermal conductivity is enhanced by natural tack on one side. Has ability to conform to various topographies. Reduces in-field failures caused by solder joint stress and fractures. Comes in sheet and die-cut formats.

Henkel, www.henkel.com/electronics

• Prev
• Next