Martin MiniOven 05 BGA/CSP reballing and QFN prebumping system provides enhanced process capability with updated firmware and increased control and temperature stability. Hybrid heating technology heats electronic components similar to a standard reflow oven. A 4-button front display enables fast setup and management of multiple user-defined reballing and prebumping profiles. Profiles are generated using auto profile software and external thermocouple for real-time product temperature feedback. Easybeam Windows-based software enables profile management and backup. Supports inert atmospheres such as nitrogen and uses a gas distribution system.

Finetech, www.finetechusa.com

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