Fujipoly’s Sarcon 30XR-Um thin film is a putty-like thermal gap filler pad. Exhibits thermal conductivity of 17 watt/m-k and a thermal resistance of 0.02 °Cin²/W. Can be compressed quickly using low compression force. The 0.3mm thin film is available in sheets up to 50 x 50mm. Can be cut to custom lengths or die-cut to fit exact shape of heat-generating components. Complies with UL 94 V-0 flame retardancy specifications and is most commonly used to transfer heat from medium to high-power CPUs and semiconductors to nearby heat sinks.

Fujipoly America, www.fujipoly.com

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