Nano is an ultra-precision die and flip-chip bonder for demanding assembly tasks.

Reportedly supports +0.3µm placement accuracy at full speed and 3 Sigma. Features include quantitative parallelism calibration for large panel handling (up to 300mm x 300mm), eutectic as well as epoxy and UV bonding, UV dispensing, and in-situ curing. Dispensing options support common dispenser technologies and material traceability. Offers three different heated options and is equipped for laser soldering and active bond force control. Machine is built on a vibration-free granite platform. Enables handling of ultra-small and very thin die.

Amicra Microtechnologies
amicra.com

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