Bergquist Bond-Ply LMS-HD thermally conductive laminate now comes in an 0.018”-thick thermal adhesive that complies with UL standards for reinforced insulation and IEC Class II insulation standards.

Provides higher standoff between device and heat sink for reinforced insulation, and maintains all high-performance properties of standard thickness version. Heat-curable formulation delivers thermal performance of 1.4 W/m-K and strong adhesion, eliminating need for mechanical fasteners such as screws or clips. With a low modulus, the silicone-based material absorbs mechanical stresses common with assembly-level coefficient of thermal expansion (CTE) mismatches, and also provides robust protection against shock and vibration.

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