Bergquist Gap Pad TGP 12000ULM thermal interface material is for high-power-density designs such as hyperscale and cloud-scale data centers and 5G telecom infrastructures.
Combines thermal conductivity of 12.0W/m-K with soft, conforming properties to ensure wet-out at interface for optimized thermal transfer and low assembly stress. Conforms to rough or irregular surfaces; can be stored at room temp. Has low assembly stress due to low modulus of 75 hardness (Shore 000, ASTM D2240) and 173 Young’s modulus (kPa, ASTM D575).
Henkel Adhesive Technologies