EZReball 6,000 ball count BGA preforms consist of 4,000 solder balls on a 0.4mm pitch over a 45mm x 45mm package.

Can be ordered and built in configurations from 6 to 6,000-plus balls. Sizes of the balls range from 10 to 40 mils in solder alloys of Sn63Pb37, SAC 305 and Sn10Pb90. Each is made to order using laser machining.

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PCB West Virtual 2020 has more than 125 hours’ worth of technical sessions on printed circuit design and manufacturing available through Oct. 12.  pcbwest.com 

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