TempSave soldering materials address reduction of peak reflow temp. to reduce defects contributing to package warpage, reduce energy consumption during reflow, and avoid potential damage to temperature-sensitive devices.

TempSave B58 is eutectic SnBi alloy with melting point of 139°C. TempSave B37 is ductile hypoeutectic SnBi alloy and does not contain Ag; reportedly has outstanding drop performance. TempSave B37 P610 solder paste can be reflowed with peak temp. of 190°C. Is available in solid wire form.

Nihon Superior
nihonsuperior.co.jp/English

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