T4AB58-HF360 and T4AB58-HF360D solder pastes are for low-temp. reflow soldering processes designed for printing and dispensing applications.

T4AB58-HF360 is for printing; T4AB58-HF360D is for dispensing. Have activator that facilitates reduction-oxidation reaction. Improve insulation resistance and achieve stability in continual application and in holding and securing components during and after the component placement process. Alloy composition is Sn, 0.4Ag, and 57.6Bi with melting temp. from 138°C to 140°C, suitable for soldering heat-sensitive components and PCBs in an air atmosphere. Exhibit excellent meltability, wettability and coagulation, owing to activator that works with Sn-Bi-based solder. Resulting solder joints have low voiding.

Koki Co. Ltd.
ko-ki.co.jp

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