PF606-EP305 joint enhanced solder paste (JEP) and solder joint encapsulation material (SJEM) flux SMEF-Z52 are epoxy-based solder materials for very fine pad size (70μm) soldering, especially for advanced display packaging and assembly.

Offer advantages of conventional solder paste and anisotropic conductive paste; i.e., self-alignment and planar insulation, respectively. Flux combines capabilities of conventional flux and underfill. Epoxy cures after reflow and provides bonding strength and joint protection. Come in halogen-free versions that meet J-STD standards (≦1000ppm chlorine/ ≦ 1000ppm bromine) and IEC standard (≦900ppm chlorine/ ≦ 900ppm bromine/ ≦ 1500ppm total halogens).

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PCB EAST: The original East Coast technical conference and exhibition! Returning to the Boston suburbs in June 2021!

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