Henkel Berquist Liqui Form TLF 10000 one-part, high thermal conductivity dispensable gel provides heat transfer for high-power electronic components, improving operational efficiency and extending lifetime system reliability.

Provides 10.0 W/m-K thermal conductivity, for applications where environments can be extreme or unpredictable and reliability is critical. High gap stability for gaps ranging from 0.5 to 1.5mm. Thermal impedance of 0.45 Kcm2/W at 0.5mm bond line thickness. Thermal conductivity of 10.0 W/m-K. Fast and easy dispensing and compatibility with a wide range of dispensing equipment options; stable viscosity for less material waste. Lower dispensing pressure and assembly force place less stress on components.

Henkel

https://www.henkel-adhesives.com/us/en/product/thermal-gels/bergquist_liqui_formtlf10000.html

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