Shenmao Releases PF918-S Lead-Free BGA Spheres
PF918-S lead-free BGA spheres is formulated with SnAg4.0Bi3.0 alloy designed with high thermal impact reliability for long service life electronic products with high-reliability requirements.
Alloy has tensile strength performance 1.4 times higher than the typical SAC 305 alloy. Thermal cycling life is two times longer than SAC 305. Melting point is 211°-221°C and has a similar range to SAC 305, with same workability and reflow profile. Reportedly increases thermal reliability performance by a minimum of 30%, and provides superior mechanical shock, tensile strength and thermal cycling performances than such as SAC 305 and SAC 405.
Shenmao
PCB WEST: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com
