SMT Stencil Clean Roll is used to remove solder paste residues or other viscous materials allocated into the stencil apertures or stencil contact side surface.

Based on the material complexion, this stencil paper is capable of working with ultra-fine pitch apertures, improving cleaning cycle time due high absorption and paper texture permitting better vacuum performance. Paper material is made of hydraulicy interlaced fibers with no chemical bonding; 100% PLP. Features include plastic tubes, high absorbency, high tensile strength, liquid absorption 28 sec./5cm, 330g water per 1m². Works with all stencil technologies including nanocoated stencil foils, better solvent usage, which provides a solvent application along the stencil surface, good performance with all developed cleaning solvents including IPA and better solder paste removal, increasing PCBs processed during the cycle.

Rocka Solutions

www.rockasolultions.com

PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com

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