Master Bond EP5TC-80 is a one part, NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity.

Requires a cure at only 80°C for 1.5 to 2 hours. Features a thixotropic paste consistency and adheres well to a variety of substrates such as metals, composites, glass, ceramics, and many plastics. It is formulated for bonding, sealing and small encapsulating applications.

Electrically insulating, with a volume resistivity greater than 1014 ohm-cm. Features a low thermal resistance of 6-10 x 10-6 K·m2/W and can be applied in very thin sections due to its ultra-fine particle filler. High strength system has a tensile modulus exceeding 1.5 million psi, and a compressive strength ranging between 25,000-27,000 psi.

Exhibits good dimensional stability with a low shrinkage upon cure, a Shore D hardness of 90-100, and an elongation of 0.5 to 1.5%. Serviceable over the temperature range of -50°C to +150°C and has a glass transition temperature of 110-115°C. Available in 3cc, 5cc, 10cc and 30cc syringes and ships in dry ice.

Master Bond

www.masterbond.com

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