Saki Corporation's new high-speed camera head features an optical resolution of 15μm and achieves high-performance quality inspection with the industry's fastest cycle time.

Minimizes standby time by parallelizing image capture, data processing and inspection, and is capable of handling complex inspections of high-density printed circuit boards and mixed PCBs with extremely small and tall parts. Available as an option for the latest 3Di series of next-generation in-line 3D automated optical inspection (3D-AOI) equipment, and can be quickly and easily switched with the existing 8μm head without the need to change the entire AOI machine within the production line.

Saki Corporation

www.sakicorp.com/en/

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