Henkel's Bergquist gap filler TGF 2900LVO is a silicone-based, 2-component room temperature curable gap filler suitable for use in a wide range of electronic assembly applications.

Features low volatile outgassing, and is said to be ideal for applications sensitive to siloxane outgassing. Also features ultra-thin bondline thickness to optimize heat dissipation and transfer in challenging conditions, and offers easier dispensing and high shot consistency, making it suitable for high throughput manufacturing.

Henkel

www.henkel-adhesives.com 

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