Henkel's Loctite Ablestik ABP 8068TI is an ultra-high thermal conductivity pressure-less sintering die attach adhesive that meets automotive grade reliability standards.

Features 165 W/m-K thermal conductivity and boasts the highest thermal capability in the company’s semiconductor packaging portfolio, meeting performance requirements for high-reliability automotive and industrial power discrete semiconductor devices. Meets multiple metrics for power semiconductors like MOSFETs, and is compatible with traditional Si and newer wide-bandgap semiconductors, among other power discrete devices. Is said to demonstrate excellent sintering properties with good adhesion on copper (Cu), pre-plated (PPF), silver (Ag), and gold (Au) lead frames, robust electrical conductivity and stable RDS(on) after 1,000 hours of thermal cycling, and MSL 3 reliability. Is recommended for dies measuring 3mm x 3mm or smaller, and fully cures at 175° C or above to form a rigid sintered Ag network in the bulk epoxy and at the interface. Does not require high pressure to achieve structure, and features workability at three hours of void-free open time and 24 hours of stage time with no degradation in shear strength.

Henkel

www.henkel-adhesives.com 

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