Master Bond's EP5LTE-100 is a one part, non-premixed and frozen epoxy with a very low coefficient of thermal expansion (CTE), high glass transition temperature (Tg), and extremely high modulus.

Features a thixotropic paste consistency making it ideal for bonding, sealing and gap filling applications, and is ideal for opto-electronics or applications needing high dimensional stability and good heat resistance. Passes NASA low outgassing specifications and provides a tensile modulus that exceeds 1 million psi at room temperature. Minimal shrinkage upon cure combined with a low CTE of 8-12 x 10-6 in/in/°C enables precise alignment for bonding dissimilar substrates with low coefficients of thermal expansion. With a Tg between 120-125°C, and a service temperature range from -60°C to +175°C, is effective in high temperature environments. Is a reliable electrical insulator featuring a volume resistivity of more than 1014 ohm-cm. Bonds well to a wide variety of substrates including metals, glass, composites, ceramics and many plastics, and has good resistance to water and damp heat. Has an unlimited working life at room temperature and requires a heat cure at 100°C for 90-120 minutes. Optimum properties are obtained by post curing for 2-3 hours at 100-125°C. Available in syringes, jars, and cans.

Master Bond

www.masterbond.com

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