Indium8.9HFRV is an air reflow, no-clean solder formulated to improve the voiding performance of next generation Pb-free high reliability alloys.

Offers low voiding when used with high-reliability alloys, high transfer efficiency through small apertures (≤0.66AR), excellent wetting, superior response-to-pause performance, and compatibility with both Air and N2 reflow environments. Can be used for high-reliability alloys, and is also fully compatible with standard SnAgCu alloy systems.

Indium Corporation

www.indium.com

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