TRI's TR7700QC SII 3-D AOI is equipped with essential inspection functionalities tailored for the electronics manufacturing industry.

Features user-friendly programming for easy setup, flexible IPC-610 inspection algorithms, optional AI-powered solutions and compliance with the latest Smart Factory standards. Also features a 12MP high- speed camera and offers four factory-setting configurations ranging from high- resolution 10μm to high-speed 15μm. Is said to be able to inspect the most intricate solder joint defects, including THT components, and has interactive 3-D models to help operators quickly review detected defects, such as lifted BGA components, IC leads, connectors, switches and other mounted devices. Also features the Multi-Step Function, enabling efficient inspection of both tall (up to 40mm) and short components during the same inspection. Supports current Smart Factory Standards, including the IPC-CFX and The Hermes Standard (IPC-HERMES-9852).

Test Research, Inc

tri.com.tw

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