Göpel's Multi Line series of inspection systems support the entire manufacturing process.

Modular base system features uniform and powerful software interface that reduces training requirements, enables flexible employee scheduling and optimizes the exchange of knowledge between production staff. Can be configured for all inspection tasks throughout the entire manufacturing process: SPI, SMT and THT AOI, and also for CCI. For THT PCBAs, provides flexible transport options, with or without carriers, and all necessary camera modules, as well as THT solder inspection, even during return on the optional lower transport conveyor. Also uses 3-D technology to inspect solder joints for quality, shorts volume and pin length without flipping the PCBA. Also features Optional double-sided inspection to fully test SMT assemblies without flipping the PCBA. Is available as an SPI system for the inspection of solder paste deposits in regard to shape, height, area, bridges, volume, X/Y offset and co-planarity. For CCI, can automatically inspect protective coatings by making fluorescent coatings glow using UV LEDs of different wavelengths, and features telecentric optics and a color camera to delivers high-contrast images while enabling fast programming using CAD data and coating plans.

Göpel Electronic

goepel.com 

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